14th
International Conference
on the Technology of Plasticity
Congress Center | Mandelieu - La Napoule | Bay of Cannes | France
SEPTEMBER 24-29, 2023

Committees

ICTP 2023 Chairs


Pierre-Olivier Bouchard

Mines Paris I PSL Research University- CEMEF 

Katia Mocellin

Mines Paris I PSL Research University- CEMEF 

Régis Bigot

Arts et Metiers Institute of Technology - LCFC

Tudor Balan

Arts et Metiers Institute of Technology - LCFC

ICTP Standing Advisory Board

  • Julian Allwood, University of Cambridge (UK)
  • Tudor Balan, Arts et Métiers ParisTech (France)
  • Pierre-Olivier Bouchard, Mines ParisTech (France)
  • Jian Cao, Northwestern University (USA)
  • Yvan Chastel, Renault (France)
  • Glenn Daehn, The Ohio State University (USA)
  • Peter Groche, TU Darmstadt (Germany)
  • Gerhard Hirt, RWTH Aachen (Germany)
  • Hoon Huh, Korea Advanced Institute of Science and Technology (Korea)
  • Takashi Ishikawa, Nagoya University (Japan)
  • Chung Gil Kang, Pusan National University (Korea)
  • Manabu Kiuchi, Teikyo Heisei University (Japan)
  • Jian-Jun (J-J) Li, Huazhong University of Science and Technology (China)
  • Martins Paulo, University of Lisbon (Portugal)
  • Marion Merklein, Universität Erlangen-Nürnberg (Germany)
  • Ken-ichiro Mori, Toyohashi University of Technology (Japan)
  • Yuan Shijian, Harbin Institute of Technology (China)
  • Rajiv Shivpuri, The Ohio State University (USA)
  • Erman Tekkaya, Technische Universität Dortmund (Germany)
  • Hiroshi Utsunomiya, Osaka University (Japan)
  • Jun Yanagimoto, University of Tokyo (Japan)
     

    ICTP 2023 Scientific Committee

  • Tatsuhiko Aizawa, Shibaura Institute of Technology (Japan)
  • Julian Allwood, University of Cambridge (UK)
  • José Alves, Transvalor (France)
  • Birgit Awiszus, TU Chemnitz (Germany)
  • Tudor Balan, Arts et Metiers Institute of Technology (France)
  • Pascale Balland, Université Savoie Mont Blanc (France)
  • Dorel Banabic, Technical University of Cluj-Napoca (Romania)
  • Frédéric Barlat, Pohang University of Science and Technology (Korea)
  • Mihaela Banu, University of Michigan (USA)
  • Francois Bay, Mines Paris PSL Research University (France)
  • Niels Bay, Technical University of Denmark (Denmark)
  • Bernd-Arno Behrens, Leibniz Universität Hannover (Germany)
  • Noomane Ben Khalifa, Leuphana University of Lüneburg and Helmholtz-Zentrum Hereon (Germany)
  • Yan Beygelzimer, National Academy of Sciences of Ukraine (Ukraine)
  • Regis Bigot, Arts et Metiers Institute of Technology (France)
  • Christophe Binetruy, Ecole Centrale de Nantes (France)
  • Pierre-Olivier Bouchard, Mines Paris PSL Research University (France)
  • Jose Divo Bressan, Universidade do Estado de Santa Catarina (Brazil)
  • Alexander Brosius, Technische Universität Dresden (Germany)
  • Stefania Bruschi, University of Padova (Italy)
  • Jian Cao, Northwestern University (USA)
  • Jianguo Cao, University of Science and Technology Beijing (China)
  • Oana Cazacu, University of Florida (USA)
  • Diego Celentano, Pontificia Universidad Católica de Chile (Chile)
  • Elisabetta Ceretti, University of Brescia (Italy)
  • Jose Cesar de Sa, University of Porto (Portugal)
  • Yvan Chastel, Renault (France)
  • Francisco Chinesta, Arts et Métiers ParisTech (France)
  • Sam Coppieters, KU Leuven (Belgium)
  • Elías Cueto, University of Zaragoza (Spain)
  • Glenn Daehn, The Ohio State University (USA)
  • Prashant P. Date, Indian Institute of Technology Bombay (India)
  • Laurent Dubar, Université Polytechnique Hauts-de-France (France)
  • Joost Duflou, KU Leuven (Belgium)
  • Luigino Filice, University of Calabria (Italy)
  • Livan Fratini, Università degli Studi di Palermo (Italy)
  • Ming Wang Fu, Hong Kong Polytechnic University (China)
  • Lander Galdos, Mondragon Unibertsitatea (Spain)
  • Andrea Ghiotti, University of Padova (Italy)
  • Sergey Golovashchenko, Oakland University (USA)
  • Okan Görtan, Hacettepe University (Turkey)
  • Peter Groche, TU Darmstadt (Germany)
  • Jinjin Ha, University of New Hampshire (USA)
  • Anne-Marie Habraken, Université de Liège (Belgium)
  • Takayuki Hama, Kyoto University (Japan)
  • Nahiene Hamila, Institut de Recherche Dupuy De Lôme (France)
  • Gerhard Hirt, RWTH Aachen (Germany)
  • Peter Hodgson, Deakin University (Australia)
  • Werner Homberg, Paderborn University (Germany)
  • Sung-Tae Hong, University of Ulsan (Korea)
  • Odd Sture Hopperstad, Norwegian University of Science and Technology (Norway)
  • Yan Huang, Brunel University London (U.K.)
  • Hoon Huh, Korea Advanced Institute of Science and Technology (Korea)
  • Y.T. Im, Korea Advanced Institute of Science and Technology (Korea)
  • Takashi Ishikawa, Nagoya University (Japan)
  • Shohei Kajikawa, The University of Electro-Communications (Japan)
  • Celalettin Karadogan, Universität Stuttgart (Germany)
  • Brad Kinsey, University of New Hampshire (USA)
  • Yannis Korkolis, Ohio State University (USA)
  • Takashi Kuboki, The University of Electro-communications (Japan)
  • Toshihiko Kuwabara, Tokyo University of Agriculture and Technology (Japan)
  • Carl Labergère, Université Technologique de Troyes (France)
  • Myoung-Gyu Lee, Seoul National University (Korea)
  • Xavier Lemoine, Arcelor Mittal (France)
  • Da Yong (D-Y) Li, Shanghai Jiaotong University (China)
  • Heng Li, Northwestern Polytechnical University (China)
  • Mathias Liewald, Universität Stuttgart (Germany)
  • Jianguo Lin, Imperial College (UK)
  • Lars-Erik Lindgren, Luleå University of Technology (Sweden)
  • Hui Long, The University of Sheffield (UK)
  • Yanshan Lou, Xi'an Jiao Tong University (China)
  • Evripides Loukaides, Bath University (UK)
  • Lukasz Madej, AGH University (Poland)
  • Lionel Marcin, Safran Group (France)
  • Paulo Martins, University of Lisbon (Portugal)
  • Marion Martiny, Université de Lorraine (France)
  • Elisabeth Massoni, Mines Paris PSL Research University (France)
  • Ryo Matsumoto, Osaka University (Japan)
  • Takashi Matsuno, Tottori University (Japan)
  • Marion Merklein, Universität Erlangen-Nürnberg (Germany)
  • Junying Min, Tongji University (China)
  • Wojciech Misiolek, Lehigh University (USA)
  • Katia Mocellin, Mines Paris PSL Research University (France)
  • Pierre Montmitonnet, Mines Paris PSL Research University (France)
  • Dirk Mohr, ETH Zurich (Switzerland)
  • Y.H. Moon, Pusan National University (Korea)
  • Chris Nielsen, Technical University of Denmark (Denmark)
  • Gracious Ngaile, North Carolina State University (USA)
  • Masaaki Otsu, University of Fukui (Japan)
  • Hengan Ou, University of Nottingham (UK)
  • Aleksandr Pesin, Magnitogorsk State Technical University (Russia)
  • Jean-Philippe Ponthot, University of Liege (Belgium)
  • Warren Poole, The University of British Columbia (Canada)
  • Benoit Revil-Baudard, University of Florida (USA)
  • Alexandre Rocha da Silva, Federal University of Rio Grande do Sul (Brazil)
  • Andrzej Rosochowski, University of Strathclyde Glasgow (UK)
  • Javier Signorelli, Instituto de Fisica Rosario, Argentina
  • Beatriz Silva, Tecnico Lisboa (Portugal)
  • Andreas Sterzing, Fraunhofer IWU (Germany)
  • Erman Tekkaya, Technische Universität Dortmund (Germany)
  • Sandrine Thuillier, Université de Bretagne Sud (France)
  • Sébastien Thibaud, FEMTO-ST Institute (France)
  • Hiroshi Utsunomiya, Osaka University (Japan)
  • Ton van den Boogaard, University of Twente (Netherlands)
  • Wolfram Volk, Technical University of Munich (Germany)
  • Zhigang Wang, Gifu University (Japan)
  • Michael Worswick, University of Waterloo (Canada)
  • Jun Yanagimoto, University of Tokyo (Japan)
  • Dong-Yol Yang, Gwangju Institute of Science and Technology (Korea)
  • Jeong Yoon, Korea Advanced Institute of Science and Technology (Korea)
  • Yoshinori Yoshida, Gifu University (Japan)
  • Shi-Hong Zhang, Chinese Academy of Sciences (China)
  • Gwoqun Zhao, Shandong University (China)
  • Zhenshan Cui, Shanghai Jiao Tong University (China)

JSTP
Awards

More details

Important
Dates

Final manuscript  notification
May 22, 2023

Early registration deadline
May 19, 2023 

Standard registration deadline
September 10, 2023

Late fee registration
From September 11, 2023 and on-site


See more

Download
Flyer

Join our email list to know about important updates.